Enter by January 31
for the early-bird rate.
The IoPP Packaging Adhesives and Adhesion Committee has just completed work on three separate reports. Each discusses suggested test methods for specific types of adhesives. Reports may be viewed by clicking on the titles below:
Suggested Test Methods for Determining the Low Temperature Resistance of Hot Melt Adhesives
Suggested Test Methods for Determining the High Temperature Resistance of Hot Melt Adhesives
Suggested Test Methods for Determining the Heat Stress Resistance of Hot Melt Adhesives
The committee authored publication Adhesives in Packaging is also available for purchase in the IoPP book store. Click here, and enter search keyword "AIP" for more information or to order.
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