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2017 Packaging Education Scholarship Fund Recipients

IoPP is pleased to announce the recipients of its 2017 Packaging Education Scholarship Fund! These scholarships are given to exceptional students headed for careers in the packaging field. In addition to helping students pay for their educations, IoPP shares the talent identified through this program with its Benefactor companies as a recruiting tool for their organizations.

IoPP awarded three academic scholarships, and the Contract Packaging Association has awarded one with IoPP's support.

The 2017 recipients are:

$5,000 - PepsiCo R&D Scholarship

Whitney Petersen
University of Wisconsin-Stout

$2,500 - IoPP Packaging Education Scholarship

Joshua Jones
Clemson University

Linh Dao
Michigan State University

$2,500 Contract Packaging Association Packaging Machinery Scholarship

Anna Sadowski
Virginia Tech

Thank you to our judges:

  • Jane Chase, CPP, Fellow – Institute of Packaging Professionals, Executive Director
  • Matt Culver, CPP – Target Corporation, Manager of Packaging Engineer
  • Dennis Gros – Gros Executive Recruiters, President
  • Susan Gruskin, CPP – PepsiCo, Brand Stewardship, Beverages Packaging R+D
  • Tim Mlsna - Boston Scientific Corporation, Director of Packaging Engineering
  • Rebecca Oesterle, CPP – Just Born Quality Confections, Packaging Development Manager
  • Amy Schupbach, CPP – Adept Packaging, Packaging Engineer

Questions?
Contact Barbara Dykes (847) 686-2329; e-mail: bdykes@iopp.org

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Open for Entries

Enter by January 31
for the early-bird rate.

Learn more.

Training Opportunities in 2019:

Fundamentals of Packaging Technology Course
Next classes: March 25–29, 2019

Packaging Machinery: Basics Seminar
Next seminar: April 13, 2019

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