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2017 Packaging Education Scholarship Fund Recipients

IoPP is pleased to announce the recipients of its 2017 Packaging Education Scholarship Fund! These scholarships are given to exceptional students headed for careers in the packaging field. In addition to helping students pay for their educations, IoPP shares the talent identified through this program with its Benefactor companies as a recruiting tool for their organizations.

IoPP awarded three academic scholarships, and the Contract Packaging Association has awarded one with IoPP's support.

The 2017 recipients are:

$5,000 - PepsiCo R&D Scholarship

Whitney Petersen
University of Wisconsin-Stout

$2,500 - IoPP Packaging Education Scholarship

Joshua Jones
Clemson University

Linh Dao
Michigan State University

$2,500 Contract Packaging Association Packaging Machinery Scholarship

Anna Sadowski
Virginia Tech

Thank you to our judges:

  • Jane Chase, CPP, Fellow – Institute of Packaging Professionals, Executive Director
  • Matt Culver, CPP – Target Corporation, Manager of Packaging Engineer
  • Dennis Gros – Gros Executive Recruiters, President
  • Susan Gruskin, CPP – PepsiCo, Brand Stewardship, Beverages Packaging R+D
  • Tim Mlsna - Boston Scientific Corporation, Director of Packaging Engineering
  • Rebecca Oesterle, CPP – Just Born Quality Confections, Packaging Development Manager
  • Amy Schupbach, CPP – Adept Packaging, Packaging Engineer

Questions?
Contact Barbara Dykes (571) 485-8739; e-mail: bdykes@iopp.org

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New Address and Phone Number:
Institute of Packaging Professionals

11911 Freedom Drive, Suite 600
Reston, VA 20190-5629 USA
Phone: +1 (571) 266-4403
Email: info@iopp.org

Training Opportunities in 2019:

Fundamentals of Packaging Technology
Next classes: March 30 - April 3, 2020
April 27 - May 1, 2020

Packaging Machinery: Basics Seminar
Next seminar: March 23 - 25, 2020

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